kw.\*:("Depósito electrolítico")
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Spongy electrodeposit formation = Formation d'un dépôt électrolytique spongieuxPOPOV, K. I; KRSTAJIC, N. V; POPOV, S. R et al.Journal of applied electrochemistry. 1986, Vol 16, Num 5, pp 771-774, issn 0021-891XArticle
III. Co-electrodeposition/Removal of Copper and Nickel in a Spouted Electrochemical ReactorGRIMSHAW, Pengpeng; CALO, Joseph M; HRADIL, George et al.Industrial & engineering chemistry research. 2011, Vol 50, Num 16, pp 9532-9538, issn 0888-5885, 7 p.Article
Electrodeposition of polyaniline onto non-noble metals. I: TitaniumGESKIN, V. M.Journal de chimie physique. 1992, Vol 89, Num 5, pp 1215-1220, issn 0021-7689Conference Paper
Dépôts électrolytiques d'argent = Electrodeposits of silverLOR, P.Galvano organo traitements de surface. 1988, Vol 57, Num 588, pp 669-670, issn 0982-7870Article
The trouble with copper.. = Les difficultés rencontrées avec le cuivre..HORNER, J.Plating and surface finishing. 1987, Vol 74, Num 3, pp 34-41, issn 0360-3164Article
Les dépôts électrolytiques d'aluminium = Aluminium electrodepositsLEPETIT, P.Galvano organo traitements de surface. 1986, Vol 55, Num 570, pp 695-696, issn 0982-7870Article
II. Electrodeposition/Removal of Nickel in a Spouted Electrochemical ReactorGRIMSHAW, Pengpeng; CALO, Joseph M; SHIRVANIAN, Pezhman A et al.Industrial & engineering chemistry research. 2011, Vol 50, Num 16, pp 9525-9531, issn 0888-5885, 7 p.Article
Détermination des conditions de stabilité du front plan de croissance d'un dépôt cathodique en cas de variation périodique du courant d'électrolyse. Influence des difficultés de concentration sur les conditions de stabilitéBRAJNIN, M. I; BARABOSHKIN, A. N.Èlektrohimiâ. 1988, Vol 24, Num 12, pp 1593-1598, issn 0424-8570Article
Improved method of removing and reclaiming solution in barrel plating = Méthode améliorée d'enlèvement et de récupération de la solution lors du dépôt électrolytique au tonneauHUNT, J. E.Plating and surface finishing. 1987, Vol 74, Num 10, pp 38-39, issn 0360-3164Article
The positive impact of pollution control on the electroplating industry = L'impact positif du contrôle de la pollution sur l'industrie du dépôt électrolytiqueHELLER, R. J.Plating and surface finishing. 1986, Vol 73, Num 12, pp 26-28, issn 0360-3164Article
Conductive microemulsions for template CoNi electrodepositionSERRA, Albert; GOMEZ, Elvira; CALDERO, Gabriela et al.PCCP. Physical chemistry chemical physics (Print). 2013, Vol 15, Num 35, pp 14653-14659, issn 1463-9076, 7 p.Article
Colloidal crystallization accomplished by electrodeposition on patterned substratesLEWIS, Patrick C; KUMACHEVA, Eugenia; ALLARD, Mathieu et al.Journal of dispersion science and technology. 2005, Vol 26, Num 3, pp 259-265, issn 0193-2691, 7 p.Article
Galvanoplastie et outillages porteurs de piècesRIEU, Bernard.Galvano organo traitements de surface. 2003, Num 728, pp 182-185, issn 0982-7870, 4 p.Article
Tin-silver electroplating of Pb-free wafer bumpsBEICA, Rozalia; WANG, Kai; BROWN, Neil et al.SPIE proceedings series. 2003, pp 835-840, isbn 0-8194-5189-4, 6 p.Conference Paper
Influence des conditions de déposition électrolytique sur la formation de la structure en colonne des couches de cobaltBOLTUSHKIN, A. V; TOCHITSKIJ, T. A; FEDOSYUK, V. M et al.Èlektrohimiâ. 1989, Vol 25, Num 3, pp 359-363, issn 0424-8570Article
Maclage aux stades précoces de l'électrocristallisation du cuivre sur des supports inertesMAMONTOV, E. A; KURBATOVA, L. A; VOLENKO, A. P et al.Èlektrohimiâ. 1986, Vol 22, Num 5, pp 629-633, issn 0424-8570Article
Directed electrochemical synthesis of ZnO/PDMcT core/shell nanorod arrays with enhanced photoelectrochemical propertiesSU, Yu-Zhi; KANG XIAO; LIAO, Zhi-Jian et al.International journal of hydrogen energy. 2013, Vol 38, Num 35, pp 15019-15026, issn 0360-3199, 8 p.Article
Electrodeposition of germanium from the ionic liquid 1-butyl-1-methylpyrrolidinium dicyanamideMINXIAN WU; BROOKS, Neil R; SCHALTIN, Stijn et al.PCCP. Physical chemistry chemical physics (Print). 2013, Vol 15, Num 14, pp 4955-4964, issn 1463-9076, 10 p.Article
Integrated electroplating system modeling and simulation for near zero discharge of chemicals and metalsQIANG XU; TELUKDARIE, Arnesh; LOU, Helen H et al.Industrial & engineering chemistry research. 2005, Vol 44, Num 7, pp 2156-2164, issn 0888-5885, 9 p.Article
Graph-assisted cyclic hoist scheduling for environmentally benign electroplatingQIANG XU; YINLUN HUANG.Industrial & engineering chemistry research. 2004, Vol 43, Num 26, pp 8307-8316, issn 0888-5885, 10 p.Article
A greedy algorithm to determine the number of transporters in a cyclic electroplating processARMSTRONG, R; GU, S; LEI, L et al.INRIA / IEEE symposium on emerging technologies and factories automation. 1995, pp 460-474, isbn 0-7803-2535-4, 3VolConference Paper
Electrodeposition of polyaniline onto non-noble metals. II: NickelGESKIN, V. M.Journal de chimie physique. 1992, Vol 89, Num 5, pp 1221-1226, issn 0021-7689Conference Paper
Properties of pre-sensitized plates having electroformed iron foil supportsKANDA, K; YAMANE, K; KONDO, Y et al.Hyomen gijutsu. 1991, Vol 42, Num 7, pp 740-745, issn 0915-1869Article
Al-Cd Alloy Formation by Aluminum Underpotential Deposition from AlCl3+NaCl Melts on Cadmium SubstrateJOVICEVIC, Niko; CVETKOVIC, Vesna S; KAMBEROVIC, Zeljko J et al.Metallurgical and materials transactions. B, Process metallurgy and materials processing science. 2013, Vol 44, Num 1, pp 106-114, issn 1073-5615, 9 p.Article
Pulse electrodeposited tin sulfide films for photovoltaic applicationsANAYA, Hiran B. M; TORRES, Ildefonso Z; MATHEWS, Nini R et al.Proceedings of SPIE, the International Society for Optical Engineering. 2009, Vol 7409, issn 0277-786X, isbn 978-0-8194-7699-9 0-8194-7699-4, 1Vol, 740914.1-740914.7Conference Paper